Line / Space

• Minimal Line Widtch and Space: 90µm / 90µm (3.5mil / 3.5 mil)

Vias

• Minimal Drill Hole Size: 200µm (8mil)
• PTH Hole Aspect Ratio: 1:10
• Resin Plugging: Buried & Blind Via Hole
• Via In Pad Technology: Thermal Hole Design

Product Range

• Double sided to 32 layers
• Planar Transformer PCBs
• Heavy Copper PCBs: Cu up to 10 oz
• Metal Based PCBs: Cu up to 10 oz
• Thin PCB: 0.25 mm for Double Side, 0.35 mm for 4 Layers

Surface Finishing

• Immersion Nickel/Gold (ENIG)
• Electrolytic Hard Gold
• Gold Finger Plating
• Hot-air leveled Lead Free Solder Coat
• Organic Solder Preservative (OSP)
• Carbon Contact Printing
• Plating Edge

Board Thickness

• Finish Board Thickness: 0.25 mm – 6.0 mm

Material

• Normal FR4
• Halogen Free FR4
• CEM3
• Aluminum