Flexible Printed Circuit (FPC)

Line / Space

  • Minimal Line / Space: 25 µm / 25 µm (1 mil / 1 mil)

Vias

  • Mechanical Min. drill Size: 100 µm (4 mil)
  • Laser Min. Drill Size: 50 µm (2 mil)

Product Thickness

  • Base Material: 12.5 µm (0.5 mil) – 75 µm (3 mil)
  • 2 Layers: < 80 µm
  • 3 Layers: < 140 µm
  • 4 Layers: < 160 µm

Stiffener

  • Material: Polyimide, FR4, Aluminum, Stainless Steel

EMI

  • EMI Shielding: Silver Epoxy Coating, Silver Foil Lamination

Substrate

  • Base Material Type: Polyimide, PET, PEN, Liquid Crystal Polymer (LCP), Prepreg, FR4
  • Adhesive Type: Acrylic, Epoxy, Prepreg
  • Adhesive Thickness: 12.5 µm (0.5 mil) – 50 µm (2 mil)
  • Copper Foil Type: Rolled Annealed (RA), Electro Deposited (ED), High Temperature Elongation (HTE), High Ductility (HA)
  • Copper foil Thickness: 0.25 oz (9 µm) – 2 oz (70 µm)

Plating and Finishing

  • Organic Surface Preservative (OSP)
  • Electoless Nickel Immersion Gold (ENIG)
  • Electrolytic Hard Gold
  • Tin / Cu Platin
  • Electrolytic Soft Gold
  • Electroless Soft Nickel Gold
  • Electrolytic Nickel Palladium Soft Gold